LINEARIZER COMMUNICATIONS GROUP

CAPABILITIES

SERVING COMMERCIAL,
GOVERNMENT & AIRBORNE MARKETS

Government and Airborne markets, Linearizer Technology, Inc. (LTI) manufactures Linearizer OEM Modules for Use in TWTAs, Klystrons, and SSPAs (GaAs & GaN) providing solutions for any frequency and bandwidth. We also offer Rack Mount aftermarket solutions for existing amplifiers.

LTI manufactures Linearized Block Upconverters (LBUCs) for X, Ku, Ka and Q Satellite Bands as well as DSP Linearization, Linearizers for Millimeter-wave (to >100 GHz) & Very Wide bandwidth (>10 GHz) and Custom Test equipment.

STATE-OF-THE-ART RF ON FIBER SYSTEMS

Founded in 2004, Linear Photonics specializes in the design, development, and manufacture of state-of-the-art RF over fiber systems. Our unique blend of technical capabilities and extensive experience allows us to create products optimized for many applications and environments.  From modules to complete systems, Linear Photonics provides the best solution available.

Linear Photonics’ standard Commercial-Off-The-Shelf (COTS) products and systems transport analog RF signals over optical fiber from DC to 60 GHz and can be modified to meet specific performance and packaging needs.  Extended temperature and environmentally hardened options are available.  Full Custom and Design-to-Spec systems are also available.

HIGHLY EFFICIENT LINEARIZED
SATELLITE POWER AMPLIFIERS

Linear Space Technology develops highly efficient linearized GaN based power amplifiers for space applications.  Examples include UHF amplifiers for the TACSAT IV satellite and an L band high power amplifier for a future GPS satellite.  LST is focused on the applications of GaN devices for high power amplifiers and their associated linearizers. 

LINEARIZER COMMUNICATIONS GROUP

CUSTOM DESIGN

LCG can support custom designs to meet specific applications and environmental requirements.  The engineering team has extensive experience in RF linearization and electro-optic design. LCG has unique packaging capabilities including hybrid assembly of both electronics as well as optical components including lasers and detectors. We leverage the combination of electronics, RF technologies and optical components to develop application-specific solutions. These designs are then packaged to meet the overall environmental requirements. Package designs go from commercial requirements through high-reliability military and space environments. 

In addition to custom design capabilities, LCG has extensive manufacturing capabilities. These include hybrid component assembly, optical fiber splicing, and volume production facilities.  Manufacturing is supported by in-house test capabilities for both RF and optical performance as well as temperature and vibration testing.

LINEARIZER COMMUNICATIONS GROUP

MICRO-ELECTRONIC ASSEMBLERS

PACKAGING

The Micro-Electronics Assemblers (MEA) service provides packaging for integrated circuits and semiconductor devices in all lead count and package styles. This service provides access to our hybrid assembly capabilities to support custom packaging applications including:

• New/Start Up packaging and testing
• Installing New Circuit Technology in Old Package Styles
• Reverse Engineering for Obsolete Components
• Fiber Optic package design and concept builds
• Fiber Assembly and Alignment

Assembly Operations include wire bonding, gold ribbon attachment, epoxy die bonding, eutectic die bonding, hermetic sealing, temperature cycling and shock.

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